Patent Assignment Details
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| Reel/Frame: | 018410/0161 | |
| Pages: | 2 |
| | Recorded: | 10/12/2006 | | |
| Attorney Dkt #: | yor920060318us1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11502380
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Filing Dt:
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08/10/2006
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Publication #:
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Pub Dt:
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02/14/2008
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Title:
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Multipath soldered thermal interface between a chip and its heat sink
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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LAW OFFICES OF ROBERT J. EICHELBURG
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HODAFEL BUILDING, SUITE 200
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196 ACTON ROAD
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ANNAPOLIS, MD 21403
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