Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 018425/0911 | |
| Pages: | 6 |
| | Recorded: | 10/23/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11498873
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Filing Dt:
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08/04/2006
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Publication #:
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Pub Dt:
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02/08/2007
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Title:
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Lead-free solder
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Assignees
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| 11-2, OSAKI 1-CHOME SHINAGAWA-KU |
| TOKYO 141-0032, JAPAN |
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| C/O NIHON HANDA CO., LTD. |
| 29-4, TAIHEI 1-CHOME, SUMIDA-KU |
| TOKYO 130-0012, JAPAN |
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Correspondence name and address
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YOUNG & THOMPSON
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745 SOUTH 23RD STREET, SECOND FLOOR
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ARLINGTON, VIRGINIA 22202
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