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Reel/Frame:018457/0728   Pages: 2
Recorded: 10/31/2006
Attorney Dkt #:JG-SU-5224/500577.20073
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/17/2010
Application #:
10562235
Filing Dt:
10/31/2006
Publication #:
Pub Dt:
06/07/2007
Title:
MANUFACTURING METHOD OF SEMICONDUCTOR WAFER HAVING A TRENCH STRUCTURE AND EPITAXIAL LAYER
Assignor
1
Exec Dt:
10/06/2006
Assignee
1
2-1, SHIBAURA 1-CHOME
MINATO-KU
TOKYO, JAPAN
Correspondence name and address
JULES E. GOLDBERG
599 LEXINGTON AVENUE
REED SMITH LLP, 29TH FLOOR
NEW YORK, NY 10022

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