Patent Assignment Details
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| Reel/Frame: | 018496/0955 | |
| Pages: | 3 |
| | Recorded: | 11/02/2006 | | |
| Attorney Dkt #: | 01-1306 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/16/2010
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Application #:
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11591496
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Filing Dt:
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11/02/2006
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Publication #:
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Pub Dt:
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05/17/2007
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Title:
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METHOD FOR SEPARATING A SEMICONDUCTOR SUBSTRATE INTO A PLURALITY OF CHIPS ALONG WITH A CUTTING LINE ON THE SEMICONDUCTOR SUBSTRATE
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Assignee
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF, JAPAN 448-8661 |
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Correspondence name and address
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POSZ LAW GROUP, PLC
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DAVID G. POSZ
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12040 SOUTH LAKES DRIVE
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SUITE 101
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RESTON, VA 20191
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