Patent Assignment Details
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Reel/Frame: | 018511/0917 | |
| Pages: | 6 |
| | Recorded: | 11/13/2006 | | |
Attorney Dkt #: | 78835 (119-16 US) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/16/2010
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Application #:
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11559157
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Filing Dt:
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11/13/2006
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Publication #:
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Pub Dt:
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05/15/2008
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Title:
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WAFER LEVEL CHIP SIZE PACKAGED CHIP DEVICE WITH A DOUBLE-LAYER LEAD STRUCTURE AND METHOD OF FABRICATING THE SAME
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Assignee
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428 XINGLONG STREET |
11B/C, SUCHUN INDUSTRIAL SQUARE |
SUZHOU INDUSTRIAL PARK, CHINA 215126 |
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Correspondence name and address
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CHARLES E. WANDS
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1901 S. HARBOR CITY BLVD.
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STE. 507
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MELBOURNE, FL 32901
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