Patent Assignment Details
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| Reel/Frame: | 018522/0308 | |
| Pages: | 3 |
| | Recorded: | 11/15/2006 | | |
| Attorney Dkt #: | 72423 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/02/2010
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Application #:
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11569144
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Filing Dt:
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11/15/2006
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Publication #:
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Pub Dt:
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08/16/2007
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Title:
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METHOD FOR PROCESSING COPPER SURFACE, METHOD FOR FORMING COPPER PATTERN WIRING AND SEMICONDUCTOR DEVICE MANUFACTURED USING SUCH METHOD
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Assignee
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| 1-1, SENSUI-CHO, TOBATA-KU |
| KITAKYUSHU-SHI |
| FUKUOKA, JAPAN 804-8550 |
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Correspondence name and address
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MCGLEW AND TUTTLE, P.C.
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SCARBOROUGH STATION
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SCARBOROUGH, NY 10510-9227
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