Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 018531/0798 | |
| Pages: | 3 |
| | Recorded: | 10/19/2006 | | |
| Attorney Dkt #: | 24031US/3988P |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE 1, 2, 3 CONVEYING PARTIES, THE ASSIGNEE'S ADDRESS AND THE DOCKET NUMBER ON THE ASSIGNMENT, PREVIOUSLY RECORDED ON REEL 018244 FRAME 0072. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11510066
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Filing Dt:
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08/24/2006
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Publication #:
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Pub Dt:
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04/19/2007
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Title:
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Semiconductor device with electroless plating metal connecting layer and method for fabricating the same
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Assignee
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| NO. 6, LI-HSIN ROAD, SCIENCE BASED-INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN (R.O.C.) |
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Correspondence name and address
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SAWYER LAW GROUP LLP
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P.O. BOX 51418
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PALO ALTO, CA 94303
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