Patent Assignment Details
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| Reel/Frame: | 018546/0449 | |
| Pages: | 4 |
| | Recorded: | 11/09/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/12/2010
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Application #:
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11521156
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Filing Dt:
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09/14/2006
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Publication #:
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Pub Dt:
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03/15/2007
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Title:
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SEMICONDUCTOR IC-EMBEDDED MODULE WITH MULTILAYER SUBSTRATES WITH MULTIPLE CHIPS EMBEDDED THEREIN
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Assignee
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| 1-13-1, NIHONBASHI, CHUO-KU |
| TOKYO, JAPAN 103-8272 |
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Correspondence name and address
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KEVIN ALAN WOLFF
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WOLFF LAW OFFICES, PLLC
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209 PROVIDENCE ROAD
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CHAPEL HILL, NC 27514
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