Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 018562/0933 | |
| Pages: | 4 |
| | Recorded: | 11/22/2006 | | |
| Attorney Dkt #: | ui1 - 0005us |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11486589
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Filing Dt:
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07/14/2006
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Publication #:
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Pub Dt:
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01/25/2007
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Title:
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Method and apparatus for providing a solder area on a leadframe
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Assignee
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| 506 SOUTH WRIGHT STREET |
| 352 HENRY ADMINISTRATION BUILDING |
| URBANA, ILLINOIS 61801 |
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Correspondence name and address
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LEE & HAYES, PLLC
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421 W RIVERSIDE AVE STE 500
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SPOKANE, WA 99201
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