Patent Assignment Details
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| Reel/Frame: | 018564/0040 | |
| Pages: | 8 |
| | Recorded: | 11/29/2006 | | |
| Attorney Dkt #: | 9726 P1 CPI/COPPER |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11511869
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Filing Dt:
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08/29/2006
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Publication #:
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Pub Dt:
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03/15/2007
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Title:
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Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer
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Assignee
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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APPLIED MATERIALS, INC.
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P. O. BOX 450 A
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SANTA CLARA, CA 95052
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