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Reel/Frame:018571/0016   Pages: 3
Recorded: 11/08/2006
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11508893
Filing Dt:
08/24/2006
Publication #:
US20070049180
Pub Dt:
03/01/2007
Title:
Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices
Assignors
1
SHIDA, HIROTAKA
Exec Dt:
10/02/2006
2
TAKEMURA, AKIHIRO
Exec Dt:
10/02/2006
3
HATTORI, MASAYUKI
Exec Dt:
10/06/2006
4
MINAMIHABA, GAKU
Exec Dt:
10/16/2006
5
FUKUSHIMA, DAI
Exec Dt:
10/16/2006
6
KURASHIMA, NOBUYUKI
Exec Dt:
10/16/2006
7
YAMAMOTO, SUSUMU
Exec Dt:
10/16/2006
8
TATEYAMA, YOSHIKUNI
Exec Dt:
10/16/2006
9
YANO, HIROYUKI
Exec Dt:
10/16/2006
Assignees
1
JSR CORPORATION
6-10, TSUKIJI 5-CHOME, CHUO-KU
TOKYO, JAPAN
2
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondence name and address
OBLON, SPIVAK, MCCLELLAND, MAIER, ET AL
1940 DUKE STREET
ALEXANDRIA, VIRGINIA 22314

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