Patent Assignment Details
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| Reel/Frame: | 018634/0040 | |
| Pages: | 10 |
| | Recorded: | 11/27/2006 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD ASSIGNEE'S ADDRESS, PREVIOUSLY RECORDED AT REEL 018440 FRAME 0157. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10558269
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Filing Dt:
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10/12/2006
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Publication #:
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Pub Dt:
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05/03/2007
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Title:
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Stackable Semiconductor Chip, Stacked Semiconductor Chip Module, and Assembling, Identification and Module Environment Setting Methods Therefor
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Assignees
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| 22-22, KAGAIKE-CHO, ABENO-KU, OSAKA-SHI |
| OSAKA, JAPAN 545-8522 |
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| 4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-6334 |
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU, JAPAN 105-8001 |
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Correspondence name and address
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H. WARREN BURNAM, JR.
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NIXON & VANDERHYE P.C.
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901 NORTH GLEBE ROAD
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11TH FLOOR
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ARLINGTON, VA 22203
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