Patent Assignment Details
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| Reel/Frame: | 018669/0601 | |
| Pages: | 2 |
| | Recorded: | 12/11/2006 | | |
| Attorney Dkt #: | SUG-201-PCT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/13/2009
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Application #:
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11629074
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Filing Dt:
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12/11/2006
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Publication #:
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Pub Dt:
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11/20/2008
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Title:
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MANUFACTURING METHOD OF BONDED WAFER
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Assignee
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| 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-0005 |
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Correspondence name and address
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SNIDER & ASSOCIATES
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P.O. BOX 27613
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WASHINGTON, D.C. 20038-7613
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