Patent Assignment Details
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| Reel/Frame: | 018686/0679 | |
| Pages: | 5 |
| | Recorded: | 12/19/2006 | | |
| Conveyance: | RECORD TO CORRECT THREE ASSIGNOR NAMES ON AN ASSIGNMENT RECORDED ON REEL/FRAME 018006/0501 |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/08/2009
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Application #:
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11454397
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Filing Dt:
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06/16/2006
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Publication #:
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Pub Dt:
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12/20/2007
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Title:
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COMBINED COPPER PLATING METHOD TO IMPROVE GAP FILL
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Assignee
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| 60 WOODLANDS INDUSTRIAL PARK D. |
| STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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Correspondence name and address
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WILLIAM J. STOFFEL
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1735 MARKET ST.-STE A455
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PHILADELPHIA, PA 19103
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