Patent Assignment Details
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| Reel/Frame: | 018717/0162 | |
| Pages: | 4 |
| | Recorded: | 01/05/2007 | | |
| Attorney Dkt #: | 8728-753/FVD |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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11620423
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Filing Dt:
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01/05/2007
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Publication #:
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Pub Dt:
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07/10/2008
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Title:
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METHODS FOR FABRICATING SILICON CARRIERS WITH CONDUCTIVE THROUGH-VIAS WITH LOW STRESS AND LOW DEFECT DENSITY
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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FRANK V. DEROSA
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130 WOODBURY ROAD
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C/O F. CHAU & ASSOCIATES LLC
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WOODBURY, NY 11797
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