Patent Assignment Details
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| Reel/Frame: | 018745/0464 | |
| Pages: | 2 |
| | Recorded: | 12/26/2006 | | |
| Attorney Dkt #: | 10024.0051-00000 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/2010
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Application #:
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11644890
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Filing Dt:
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12/26/2006
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Publication #:
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Pub Dt:
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07/05/2007
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Title:
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METHOD FOR FORMING A DUAL INTERLAYER DIELECTRIC LAYER OF A SEMICONDUCTOR DEVICE
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Assignee
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| 891-10, DAECHI-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF 135-280 |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, GARRETT
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& DUNNER, L.L.P.
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901 NEW YORK AVENUE, NW
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WASHINGTON, DC 20001-4413
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