Patent Assignment Details
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| Reel/Frame: | 018778/0586 | |
| Pages: | 2 |
| | Recorded: | 01/08/2007 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/09/2009
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Application #:
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11650503
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Filing Dt:
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01/08/2007
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Publication #:
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Pub Dt:
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07/19/2007
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Title:
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WAFER DIVIDING METHOD AND WAFER DIVIDING APPARATUS
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Assignee
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| 13-11, OMORI-KITA 2-CHOME, OTA-KU |
| TOKYO 143-8580, JAPAN |
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Correspondence name and address
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MICHAEL A. MAKUCH
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SMITH, GAMBRELL & RUSSELL, LLP
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1850 M STREET, NW - SUITE 800
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WASHINGTON, DC 20036
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