Patent Assignment Details
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| Reel/Frame: | 018801/0069 | |
| Pages: | 3 |
| | Recorded: | 01/12/2007 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/24/2010
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Application #:
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11632347
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Filing Dt:
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01/12/2007
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Publication #:
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Pub Dt:
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04/10/2008
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Title:
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RESIN COMPOSITION AND MOLDED ARTICLES THEREOF
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Assignees
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| 2-2, UCHISAIWAICHO 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-0011 |
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| 1-2, HIRANOMACHI 4-CHOME |
| CHUO-KU |
| OSAKA-SHI, OSAKA, JAPAN 541-0046 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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ATTN: MATTHEW M. JACOB, ESQ.
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2033 K STREET, N.W., SUITE 800
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WASHINGTON, D.C. 20006-1021
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