Patent Assignment Details
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| Reel/Frame: | 018830/0658 | |
| Pages: | 2 |
| | Recorded: | 01/18/2007 | | |
| Attorney Dkt #: | 073752-0042 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11654670
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Filing Dt:
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01/18/2007
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Publication #:
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Pub Dt:
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07/19/2007
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Title:
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Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device
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Assignees
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| 2-1, YAESU 2-CHOME, CHUO-KU |
| TOKYO 104-0028, JAPAN |
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| 2-7, YAESU 2-CHOME, CHUO-KU |
| TOKYO 104-0028, JAPAN |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005-3096
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