Patent Assignment Details
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| Reel/Frame: | 018864/0372 | |
| Pages: | 3 |
| | Recorded: | 02/07/2007 | | |
| Attorney Dkt #: | JG-SU-5221/500577.20071 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10561821
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Filing Dt:
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02/07/2007
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Publication #:
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Pub Dt:
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11/22/2007
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Title:
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Processing Method of Silicon Wafer
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Assignee
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| 2-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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JULES E. GOLDBERG, REED SMITH LLP
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599 LEXINGTON AVENUE, 29TH FLOOR
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NEW YORK, NY 10022
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