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Reel/Frame:018864/0668   Pages: 3
Recorded: 02/07/2007
Attorney Dkt #:JG-SU-5222/500577.20072
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/12/2010
Application #:
10562236
Filing Dt:
02/07/2007
Publication #:
Pub Dt:
05/31/2007
Title:
MANUFACTURING METHOD OF SILICON WAFER
Assignors
1
Exec Dt:
12/20/2005
2
Exec Dt:
12/20/2005
Assignee
1
2-1, SHIBAURA 1-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondence name and address
JULES E. GOLDBERG, REED SMITH LLP
599 LEXINGTON AVENUE, 29TH FLOOR
NEW YORK, NY 10022

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