Patent Assignment Details
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| Reel/Frame: | 018879/0706 | |
| Pages: | 6 |
| | Recorded: | 02/08/2007 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/29/2007
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Application #:
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10900898
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Filing Dt:
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07/27/2004
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Publication #:
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Pub Dt:
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02/03/2005
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Title:
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LIQUID-COOLED HEAT SINK ASSEMBLY
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Assignees
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| 7&8 BUILDINGS, 98 INDUSTRIAL PARK, WAN-FENG VILLAGE, SHA-JING TOWN, BAO'AN DISTRICT. |
| SHENZHEN CITY, CHINA 518104 |
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| 3-2, CHUNG SHAN ROAD |
| TU-CHENG, TAIPEI HSIEN, TAIWAN 236 |
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Correspondence name and address
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WEI-TE CHUNG
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FOXCONN INTERNATIONAL, INC.
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1650 MEMOREX DRIVE
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SANTA CLARA, CA 95050
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