Patent Assignment Details
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Reel/Frame: | 018893/0045 | |
| Pages: | 4 |
| | Recorded: | 02/12/2007 | | |
Attorney Dkt #: | P2703US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/01/2013
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Application #:
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11652462
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Filing Dt:
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01/11/2007
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Publication #:
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Pub Dt:
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07/19/2007
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Title:
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Polyamideimide resin for flexible printed circuit boards; metal-clad laminate, coverlay, and flexible printed circuit board that use this resin; and resin composition
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Assignee
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5-5, MINAMI-HONCHO 1-CHOME |
JOETSU-SHI, NIIGATA, JAPAN 943-8610 |
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Correspondence name and address
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BRIAN C. RUPP
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DRINKER BIDDLE & REATH LLP
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191 N. WACKER DRIVE
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SUITE 3700
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CHICAGO, IL 60606-1698
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