Patent Assignment Details
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| Reel/Frame: | 018997/0741 | |
| Pages: | 5 |
| | Recorded: | 02/23/2007 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11660970
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Filing Dt:
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02/23/2007
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Publication #:
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Pub Dt:
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02/21/2008
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Title:
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Fine Pattern Forming Material, Method Of Forming Fine Resist Pattern And Electronic Device
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Assignees
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| 4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO 100-6334, JAPAN |
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| BUNKYO GREEN COURT |
| 28-8, HONKOMAGOME, 2-CHOME, BUNKYO-KU |
| TOKYO 113-0021, JAPAN |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005-3096
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