Patent Assignment Details
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Reel/Frame: | 019081/0163 | |
| Pages: | 4 |
| | Recorded: | 03/28/2007 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11654864
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Filing Dt:
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01/18/2007
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Publication #:
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Pub Dt:
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07/24/2008
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Title:
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Cu-Ni-Si system copper alloy for electronic materials
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Assignee
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10-1, TORANOMON 2-CHOME |
MINATO-KU, TOKYO 105-0001, JAPAN |
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Correspondence name and address
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DANIEL A. MONACO
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DRINGER BIDDLE & REATH LLP
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ONE LOGAN SQUARE
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18TH AND CHERRY STREETS
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PHILADELPHIA, PA 19103-6996
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