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Reel/Frame:019089/0216   Pages: 3
Recorded: 03/09/2007
Attorney Dkt #:9319I-002110
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11716738
Filing Dt:
03/09/2007
Publication #:
Pub Dt:
09/20/2007
Title:
Method of manufacturing interconnect substrate
Assignors
1
Exec Dt:
02/23/2007
2
Exec Dt:
02/28/2007
3
Exec Dt:
02/28/2007
Assignee
1
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU
TOKYO, JAPAN 163-0811
Correspondence name and address
G. GREGORY SCHIVLEY
HARNESS DICKEY & PIERCE, PLC
P.O. BOX 828
BLOOMFIELD HILLS, MI 48303

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