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Reel/Frame:019103/0070   Pages: 2
Recorded: 03/22/2007
Attorney Dkt #:050395-0407
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/31/2013
Application #:
11663450
Filing Dt:
03/22/2007
Publication #:
Pub Dt:
09/03/2009
Title:
Conductive paste and multilayer printed wiring board using the same
Assignors
1
Exec Dt:
02/13/2007
2
Exec Dt:
02/13/2007
3
Exec Dt:
03/06/2007
Assignee
1
5-33 KITAHAMA 4-CHOME, CHUO-KU
OSAKA-SHI, OSAKA 541-0041, JAPAN
Correspondence name and address
MCDERMOTT WIL & EMERY LLP
STEPHEN A. BECKER
600 13TH STREET, N.W.
WASHINGTON, D.C. 20005-3096

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