Patent Assignment Details
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| Reel/Frame: | 019125/0555 | |
| Pages: | 3 |
| | Recorded: | 03/23/2007 | | |
| Attorney Dkt #: | 071331 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/19/2011
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Application #:
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11727001
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Filing Dt:
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03/23/2007
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Publication #:
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Pub Dt:
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10/04/2007
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Title:
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ROUGHNESS REDUCING FILM AT INTERFACE, MATERIALS FOR FORMING ROUGHNESS REDUCING FILM AT INTERFACE, WIRING LAYER AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Assignee
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS & ADRIAN, LL
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1250 CONNECTICUT AVENUE, NW
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SUITE 700
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WASHINGTON, DC 20036
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