Patent Assignment Details
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| Reel/Frame: | 019139/0749 | |
| Pages: | 2 |
| | Recorded: | 04/09/2007 | | |
| Attorney Dkt #: | 131393 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/19/2011
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Application #:
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11706367
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Filing Dt:
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02/15/2007
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Publication #:
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Pub Dt:
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08/21/2008
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Title:
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METHOD OF MANUFACTURING ELECTRONIC COMPONENT PACKAGE, AND WAFER AND SUBSTRUCTURE USED FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE
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Assignees
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| 678 S. HILLVIEW DR. |
| MILPITAS, CALIFORNIA 95035 |
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| 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
| SAE TECHNOLOGY CENTRE |
| HONG KONG, CHINA |
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Correspondence name and address
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JAMES A. OLIFF
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OLIFF & BERRIDGE, PLC
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P.O. BOX 19928
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ALEXANDRIA, VA 22320
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