Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 019225/0615 | |
| Pages: | 2 |
| | Recorded: | 04/27/2007 | | |
| Attorney Dkt #: | 04359/LH |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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05/04/2010
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Application #:
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10860478
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Filing Dt:
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06/02/2004
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Publication #:
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Pub Dt:
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12/09/2004
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING CONNECTED UPPER AND LOWER INTERCONNECTIONS
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Patent #:
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Issue Dt:
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02/10/2009
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Application #:
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11018138
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Filing Dt:
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12/20/2004
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Publication #:
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Pub Dt:
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06/30/2005
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Title:
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SEMICONDUCTOR DEVICE INCLUDING A HARD SHEET TO REDUCE WARPING OF A BASE PLATE AND METHOD OF FABRICATING THE SAME
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Patent #:
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Issue Dt:
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10/09/2007
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Application #:
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11093570
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Filing Dt:
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03/30/2005
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Publication #:
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Pub Dt:
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10/06/2005
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Title:
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SEMICONDUCTOR DEVICE INCORPORATING A SEMICONDUCTOR CONSTRUCTING BODY AND AN INTERCONNECTING LAYER WHICH IS CONNECTED TO A GROUND LAYER VIA A VERTICAL CONDUCTING PORTION
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Patent #:
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Issue Dt:
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08/14/2007
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Application #:
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11143293
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Filing Dt:
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06/01/2005
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Publication #:
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Pub Dt:
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12/08/2005
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Title:
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SEMICONDUCTOR DEVICE HAVING ADHESION INCREASING FILM TO PREVENT PEELING
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Assignee
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| 5-1, NISHISHINJUKU 6-CHOME |
| SHINJUKU-KU, TOKYO, JAPAN 1631388 |
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN & CHICK, PC
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220 FIFTH AVENUE
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16TH FLOOR
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NEW YORK, NY 10001-7708
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