Patent Assignment Details
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| Reel/Frame: | 019256/0547 | |
| Pages: | 5 |
| | Recorded: | 05/07/2007 | | |
| Attorney Dkt #: | 125155.00019 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/23/2010
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Application #:
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11745045
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Filing Dt:
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05/07/2007
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Publication #:
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Pub Dt:
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11/13/2008
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Title:
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ULTRA THIN BUMPED WAFER WITH UNDER-FILM
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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ROBERT D. ATKINS
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QUARLES & BRADY LLP
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TWO NORTH CENTRAL AVENUE
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PHOENIX, AZ 85004
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