Patent Assignment Details
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| Reel/Frame: | 019271/0024 | |
| Pages: | 3 |
| | Recorded: | 05/09/2007 | | |
| Attorney Dkt #: | 10060105-1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/23/2010
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Application #:
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11590639
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Filing Dt:
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10/31/2006
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Publication #:
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Pub Dt:
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05/01/2008
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Title:
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SYSTEMS, DEVICES, COMPONENTS AND METHODS FOR HERMETICALLY SEALING ELECTRONIC MODULES AND PACKAGES
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Assignee
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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JOHN R. PESSETTO
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P.O. BOX 1920
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DENVER, CO 80201
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