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Reel/Frame:019282/0250   Pages: 7
Recorded: 05/11/2007
Attorney Dkt #:TIC-0120
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/27/2010
Application #:
11670645
Filing Dt:
02/02/2007
Publication #:
Pub Dt:
08/23/2007
Title:
CONNECTION STRUCTURE FOR CONNECTING FLEXIBLE PRINTED CIRCUIT TO MAIN SUBSTRATE USING A POTTING RESIN IN A THROUGH-HOLE
Assignors
1
Exec Dt:
02/13/2007
2
Exec Dt:
02/13/2007
3
Exec Dt:
02/13/2007
4
Exec Dt:
02/13/2007
Assignee
1
2-1, TOYODA-CHO
KARIYA-SHI
AICHI, JAPAN 448-8671
Correspondence name and address
DARLEEN J. YACOVONE
2929 ARCH STREET
CIRA CENTRE, 12TH FLOOR
PHILADELPHIA, PA 19104

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