Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 019288/0277 | |
| Pages: | 23 |
| | Recorded: | 05/12/2007 | | |
| Attorney Dkt #: | TESHEL3.0-018 BTESHEL.163 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/03/2011
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Application #:
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11655777
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Filing Dt:
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01/19/2007
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Publication #:
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Pub Dt:
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08/16/2007
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Title:
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WAFER LEVEL CHIP PACKAGING
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Assignee
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| 1126 BUDAPEST |
| UGOCSA U. 4/B |
| BUDAPEST, HUNGARY |
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Correspondence name and address
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DARYL K. NEFF
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LERNER, DAVID, LITTENBERG,
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KRUMHOLZ & MENTLIK, LLP
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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