Patent Assignment Details
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| Reel/Frame: | 019366/0095 | |
| Pages: | 4 |
| | Recorded: | 05/24/2007 | | |
| Attorney Dkt #: | 04329.4127 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11717045
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Filing Dt:
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03/13/2007
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Publication #:
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Pub Dt:
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10/04/2007
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Title:
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Slurry for touch-up CMP and method of manufacturing semiconductor device
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Assignee
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO 105-8001, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, GARRETT &
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LLP
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901 NEW YORK AVENUE, NW
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WASHINGTON, DC 20001-4413
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