Patent Assignment Details
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| Reel/Frame: | 019369/0548 | |
| Pages: | 4 |
| | Recorded: | 06/01/2007 | | |
| Attorney Dkt #: | HYU 42025 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/22/2012
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Application #:
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11690438
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Filing Dt:
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03/23/2007
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Publication #:
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Pub Dt:
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03/13/2008
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Title:
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ETCHING LIQUID, ETCHING METHOD, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
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Assignee
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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MICHAEL W. GARVEY
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1801 EAST 9TH STREET, SUITE 1200
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CLEVELAND, OH 44114-3108
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