Patent Assignment Details
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Reel/Frame: | 019380/0522 | |
| Pages: | 10 |
| | Recorded: | 05/29/2007 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/10/2012
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Application #:
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11715261
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Filing Dt:
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03/07/2007
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Publication #:
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Pub Dt:
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09/20/2007
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Title:
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ENHANCING METAL/LOW-K INTERCONNECT RELIABILITY USING A PROTECTION LAYER
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Assignees
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5A SERANGOON NORTH AVENUE 5 |
SINGAPORE 554574 |
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50 NANYANG AVENUE |
SINGAPORE 639798 |
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Correspondence name and address
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STMICROELECTRONICS, INC.
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MAIL STATION 2346?
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1310 ELECTRONICS DRIVE
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CARROLLTON, TX 75006
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