Patent Assignment Details
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| Reel/Frame: | 019386/0504 | |
| Pages: | 4 |
| | Recorded: | 06/05/2007 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11638884
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Filing Dt:
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12/13/2006
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Publication #:
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Pub Dt:
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06/19/2008
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Title:
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Solid via with a contact pad for mating with an interposer of an ATE tester
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Assignee
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| NO. 1 YISHUN AVE. 7 |
| SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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VALERLE BAKES
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VERIGY LTD.
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LEGAL DEPARTMENT
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4700 INNOVATION DRIVE, BUILDING, D1
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FORT COLLINS, CO 80525
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