Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 019389/0692 | |
| Pages: | 5 |
| | Recorded: | 06/06/2007 | | |
| Attorney Dkt #: | 4972-0001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11758883
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Filing Dt:
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06/06/2007
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Publication #:
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Pub Dt:
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12/13/2007
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Title:
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SEMICONDUCTOR CUTTING DEVICE, SEMICONDUCTOR CUTTING METHOD, SEMICONDUCTOR CUTTING SYSTEM, LASER CUTTING DEVICE AND LASER CUTTING METHOD
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Assignee
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| 90 KAMITOKUMA, CHIKUMA-SHI |
| NAGANO-KEN, JAPAN 389-0898 |
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Correspondence name and address
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MORGAN & FINNEGAN LLP
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3 WORLD FINANCIAL CENTER
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NEW YORK, NY 10281-2101
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