Patent Assignment Details
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Reel/Frame: | 019400/0605 | |
| Pages: | 3 |
| | Recorded: | 05/23/2007 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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11805457
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Filing Dt:
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05/23/2007
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Publication #:
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Pub Dt:
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11/29/2007
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Title:
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ADHESIVE COMPOSITION, ADHESIVE SHEET AND PRODUCTION PROCESS FOR SEMICONDUCTOR DEVICE
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Assignee
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23-23, HONCHO, ITABASHI-KU |
TOKYO, JAPAN 1730001 |
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Correspondence name and address
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KENT E. BALDAUF
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THE WEBB LAW FIRM
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700 KOPPERS BUILDING
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436 SEVENTH AVENUE
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PITTSBURGH, PA 15219
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