Patent Assignment Details
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| Reel/Frame: | 019409/0258 | |
| Pages: | 4 |
| | Recorded: | 06/04/2007 | | |
| Attorney Dkt #: | 2557-000433/US |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED ON REEL 019202, FRAME 0711. ASSINGORS HEREBY CONFIRM THE ASSIGNMENT OF THE ENTIRE INTEREST. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11586615
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Filing Dt:
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10/26/2006
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Publication #:
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Pub Dt:
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08/16/2007
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Title:
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Semiconductor package, stack package using the same package and method of fabricating the same
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Assignee
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| 416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 8910
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RESTON, VA 20195
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