Patent Assignment Details
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| Reel/Frame: | 019436/0160 | |
| Pages: | 2 |
| | Recorded: | 06/06/2007 | | |
| Attorney Dkt #: | WANG3423/EM |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/11/2011
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Application #:
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11808028
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Filing Dt:
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06/06/2007
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Publication #:
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Pub Dt:
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02/07/2008
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Title:
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FLIP-CHIP PACKAGE SUBSTRATE AND A METHOD FOR FABRICATING THE SAME
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Assignee
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| NO. 6, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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BACON & THOMAS, PLLC
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625 SLATERS LANE
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FOURTH FLOOR
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ALEXANDRIA, VA 22314
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