Patent Assignment Details
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| Reel/Frame: | 019526/0861 | |
| Pages: | 14 |
| | Recorded: | 07/09/2007 | | |
| Attorney Dkt #: | 8040-1093 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11798684
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Filing Dt:
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05/16/2007
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Publication #:
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Pub Dt:
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11/22/2007
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Title:
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Method of forming a multilayer wiring by the use of copper damascene technique
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Assignees
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| 7-1, SHIBA 5-CHOME |
| MINATO-KU |
| TOKYO, JAPAN |
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| 21, SAIIN MIZOSAKI-CHO |
| UKYO-KU |
| KYOTO, JAPAN 615-8585 |
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| 5-5, KEIHAN-HONDORI 2-CHOME |
| MORIGUCHI CITY |
| OSAKA, JAPAN 570-8677 |
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| 2500, HAGISONO |
| KANAGAWA |
| CHIGASAKI-SHI, JAPAN 253-8543 |
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| 6-2, OTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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YOUNG & THOMPSON
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745 S. 23RD STREET
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2ND FLOOR
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ARLINGTON, VA 22202
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