Patent Assignment Details
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| Reel/Frame: | 019548/0722 | |
| Pages: | 4 |
| | Recorded: | 07/12/2007 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/21/2010
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Application #:
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11661821
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Filing Dt:
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06/01/2007
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Publication #:
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Pub Dt:
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11/08/2007
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Title:
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PROCESS FOR FORMING BUMPS AND SOLDER BUMP
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Assignee
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| 1006 OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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Correspondence name and address
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KENJI KAMATA
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1130 CONNECTICUT AVE., N.W., SUITE 1100
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PANASONIC PATENT CENTER
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WASHINGTON, DC 20036
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