Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 019599/0106 | |
| Pages: | 10 |
| | Recorded: | 07/26/2007 | | |
| Attorney Dkt #: | AF02560/SPSNP1168US |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT INVENTOR'S NAME PREVIOUSLY RECORDED ON REEL 019496 FRAME 0587. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT INVENTOR'S NAME. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11770239
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Filing Dt:
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06/28/2007
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Publication #:
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Pub Dt:
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01/01/2009
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Title:
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A semiconductor device for stacking dies in a multi-die chip packing using film over wire as well as multi-die chip devices that include film over wire
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Assignee
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| 915 DEGUIGNE |
| SUNNYVALE, CALIFORNIA 94088 |
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Correspondence name and address
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AMIN, TUROCY & CALVIN LLP
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1900 EAST 9TH STREET
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24TH FLOOR, NATIONAL CITY CENTER
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CLEVELAND, OH 44114
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