Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 019614/0665 | |
| Pages: | 2 |
| | Recorded: | 07/26/2007 | | |
| Attorney Dkt #: | 30794.116-US-U1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/18/2008
|
Application #:
|
11175761
|
Filing Dt:
|
07/06/2005
|
|
Publication #:
|
|
Pub Dt:
|
01/12/2006
| | | | |
|
Title:
|
METHOD FOR WAFER BONDING (AL, IN, GA)N AND ZN(S, SE) FOR OPTOELECTRONIC APPLICATIONS
|
|
|
Assignee
|
|
|
|
|
| 4-1-8, HONCHO |
| KAWAGUCHI CITY, SAITAMA PREFECTURE, JAPAN 332-0012 |
|
|
Correspondence name and address
|
| |
GEORGE H. GATES, ESQ.
|
| |
GATES & COOPER LLP
|
| |
6701 CENTER DRIVE WEST, SUITE 1050
|
| |
LOS ANGELES, CA 90045
|
Search Results as of:
04/26/2024 03:38 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
