Patent Assignment Details
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| Reel/Frame: | 019663/0561 | |
| Pages: | 5 |
| | Recorded: | 08/07/2007 | | |
| Conveyance: | RE-RECORD TO CORRECT THE RECEIVING PARTY PREVIOUSLY RECORDED AT R/F 14573/92 |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/23/2007
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Application #:
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10756763
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Filing Dt:
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01/14/2004
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Publication #:
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Pub Dt:
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08/19/2004
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Title:
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AN ELECTRONIC PARTS PACKAGING STRUCTURE IN WHICH A SEMICONDUCTOR CHIP IS MOUNTED ON A WIRING SUBSTRATE AND BURIED IN AN INSULATION FILM
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Assignee
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| 80, OSHIMADA-MACHI, NAGANO-SHI |
| NAGANO, JAPAN 381-2287 |
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Correspondence name and address
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KRATZ, QUINTOS & HANSON, LLP
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1420 K STREET, NW, SUITE 400
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WASHINGTON, DC 20005
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