Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 019674/0051 | |
| Pages: | 7 |
| | Recorded: | 08/09/2007 | | |
| Attorney Dkt #: | JG-SU-5286/500577.20116 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11836493
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Filing Dt:
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08/09/2007
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Publication #:
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Pub Dt:
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02/12/2009
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Title:
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METHOD FOR MANUFACTURING SILICON WAFERS USING ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL
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Assignee
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| 2-1 SHIBAURA 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-8634 |
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Correspondence name and address
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JULES E. GOLDBERG
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599 LEXINGTON AVENUE, 29TH FLOOR
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REED SMITH, LLP
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NEW YORK, NY 10022
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