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Reel/Frame:019680/0992   Pages: 8
Recorded: 08/10/2007
Attorney Dkt #:YPL-PT025
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/20/2011
Application #:
11752729
Filing Dt:
05/23/2007
Publication #:
Pub Dt:
12/06/2007
Title:
AU-AG BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE
Assignors
1
Exec Dt:
06/28/2007
2
Exec Dt:
06/28/2007
3
Exec Dt:
06/28/2007
4
Exec Dt:
06/28/2007
5
Exec Dt:
06/28/2007
Assignee
1
316-2 GEUMEO-RI, POGOK-MYEON
YONGIN-CITY
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondence name and address
ELLEN E. FIELITZ
30 S. 17T H STREET
UNITED PLAZA, SUITE 1600
PHILADELPHIA, PA 19103

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