Patent Assignment Details
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| Reel/Frame: | 019681/0579 | |
| Pages: | 2 |
| | Recorded: | 07/31/2007 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11888155
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Filing Dt:
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07/31/2007
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Publication #:
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Pub Dt:
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01/31/2008
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Title:
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Bonding apparatus
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Assignee
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| 2-51-1, INADAIRA |
| MUSASHIMURAYAMA-SHI TOKYO, JAPAN |
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Correspondence name and address
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WILLIAM L. ANDROLIA
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KODA & ANDROLIA
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2029 CENTURY PARK EAST, SUITE 1140
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LOS ANGELES, CA 90067-2983
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